Non-destructive evaluation of residual stresses in thin films via x-ray diffraction topography methods-Reference-Cited by-同舟云学术

Non-destructive evaluation of residual stresses in thin films via x-ray diffraction topography methods

Published:1991-07 Issue:7 Volume:20 Page:819-825
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Tao J.,Lee L. H.,Bilello J. C.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02665970.pdf

Reference25 articles.

1. K. L. Chopra, Thin Film Phenomena, McGraw-Hill, New York, (1969), p. 266.

2. J. Thornton, Thin Solid Film171,5 (1989).

3. D. W. Hoffman, J. Vac. Sci. Tech.20, 355 (1982).

4. J. C. Bravman, W. D. Nix, D. M. Barnett and D. A. Smith, eds. Thin Films: Stresses and Mechanical Properties, MRS Symp., Vol. 130, Mater. Res. Soc—Pittsburgh, PA (1989).

5. M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. Brotzen, eds. Thin Films: Stresses and Mechanical Properties II, MRS Symposium, Vol. 188, Mater. Res. Soc—Pittsburgh, PA (1990).

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