1. Solder Fatigue Analyses and Predictions for PCB Mounted Components after Thirteen Years of Thermal Field Cycling;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Physics of Degradation based Surrogate Model using Deep Learning for Lifetime Prognostics of Solder Joints in Microelectronics;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
3. Optimized FE Model for System-Level Solder Joint Reliability Analysis of a Flip-Chip Ball Grid Array Package;New Advances in Mechanisms, Mechanical Transmissions and Robotics;2020-10-15
4. Advances in LED Solder Joint Reliability Testing and Prediction;Solid State Lighting Reliability Part 2;2017-07-13
5. Thermal Fatigue Analysis;The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects;2011