1. Tummala RR (2001): Introduction to Microsystems Packaging. Fundamentals of Microsystems Packaging, pp 13
2. Tai KL (2000): System-In-Package (SIP): challenges and opportunities. Asia and South Pacific Design Automation Conference, pp 191–196
3. Vardaman EJ (2000): Low cost options for next generation packaging. 3rd Electronics Packaging Technology Conference (EPTC 2000), pp 457–459
4. Zheng L-R, Liu, J (2002): System-on-Packaging: A Broad Perspective from System Design to Technology Development. The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP’02), Shanghai, China, pp 183–191
5. Kivilahti J, Morris JE, Suga T, Wong CP (2002): Panel-Size Component Integration (PCI) with Moulded Liquid Crystal Polymer (LCP) Substrates. ECTC’02, San Diego, USA., pp 955–961