Author:
Wongpreedee K.,Russell A. M.
Publisher
Springer Science and Business Media LLC
Subject
Inorganic Chemistry,General Materials Science
Reference22 articles.
1. “Gold Survey 2001”, Gold Fields Mineral Services (www.gfms.co.uk)
2. C. Muhlstein, ASTM Standardization News, Nov 1999, 30
3. R.R. Tummala, E.J. Rymaszewski, and A.G. Klopfenstein,Microelectronics Packaging Handbook, 2nd edition, Chapman & Hall, 1997
4. G. G. Harman, Wire Bonding in Microelectronics;Materials, Process, Reliability, and Yield, 2nd edition, McGraw-Hill, 1997
5. A.M. Russell, K. Xu, L.S. Chumbley, J.J. Parks, and J.L. Harringa,Gold Bull., 1998,31(3), 82
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