A computational modeling approach based on random fields for short fiber-reinforced composites with experimental verification by nanoindentation and tensile tests

Author:

Rauter NatalieORCID

Abstract

AbstractIn this study a modeling approach for short fiber-reinforced composites is presented which allows one to consider information from the microstructure of the compound while modeling on the component level. The proposed technique is based on the determination of correlation functions by the moving window method. Using these correlation functions random fields are generated by the Karhunen–Loève expansion. Linear elastic numerical simulations are conducted on the mesoscale and component level based on the probabilistic characteristics of the microstructure derived from a two-dimensional micrograph. The experimental validation by nanoindentation on the mesoscale shows good conformity with the numerical simulations. For the numerical modeling on the component level the comparison of experimentally obtained Young’s modulus by tensile tests with numerical simulations indicate that the presented approach requires three-dimensional information of the probabilistic characteristics of the microstructure. Using this information not only the overall material properties are approximated sufficiently, but also the local distribution of the material properties shows the same trend as the results of conducted tensile tests.

Funder

Projekt DEAL

Publisher

Springer Science and Business Media LLC

Subject

Applied Mathematics,Computational Mathematics,Computational Theory and Mathematics,Mechanical Engineering,Ocean Engineering,Computational Mechanics

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3