Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. D. B. Tuckerman and R. F. W. Pease, IEEE Electron Dev. Lett. EDL-2, 126 (1981).
2. M. Mahalingam, Proc IEE. 73, 1396 (1985).
3. T. Kishimoto and T. Ohsaki, “VLSI Packaging Technique Us- ing Liquid-Cooled Channels,” Proc. Elect. Components Conf., 595, 1986.
4. D. B. Tuckerman, “Heat-Transfer Microstructures for Inte- grated Circuits,” Ph.D. Thesis, Lawrence Livermore National Laboratory, UCRL-53515, 1984.
5. R. W. Keyes, IEEE Trans. Electron Dev. ED-31, 1218 (1984).
Cited by
71 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献