The parylene-aluminum multilayer interconnection system for wafer scale integration and wafer scale hybrid packaging-Reference-Cited by-同舟云学术

The parylene-aluminum multilayer interconnection system for wafer scale integration and wafer scale hybrid packaging

Published:1989-03 Issue:2 Volume:18 Page:301-311
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Majid N.,Dabral S.,McDonald J. F.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02657422.pdf

Reference23 articles.

1. J. F. McDonald, A. J. Steckl, C. A. Neugebauer, R. O. Carlson and A. S. Bergendahl, J. Vac. Sci. Tech. A 4, 3127 (1986).

2. K. L. Mittal, Ed., “Polyimides—Synthesis, Characterization, and Applications,“ Volumes I, II, Plenum Press, 1984.

3. R. Selvaraj, S. N. Yang, J. F. McDonald and T. M. Lu, “Ion Cluster Beam Metallized Interconnections of Wafer Scale Integration,“ Proc. VLSI 1987 Multilayer Interconnection Conf., V-MIC87, Santa Clara, CA, pp. 440–448, June 15–16, 1987.

4. N. Majid, S. Dabral, H. T. Lin and J. F. McDonald, “Parylene as an Interlayer Dielectric for Wafer Scale Interconnections,“ Proc. VLSI 1988 Multilayer Interconnection Conf., V-MIC88, Santa Clara, CA, pp. June 13–14, 1988.

5. W. F. Gorham, US Patent 3,342,754, Para-Xylylene Polymers, Sept. 1967.

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