Solvability for Some Higher Order Multi-Point Boundary Value Problems at Resonance
Author:
Publisher
Springer Science and Business Media LLC
Subject
Applied Mathematics,Mathematics (miscellaneous)
Link
http://link.springer.com/content/pdf/10.1007/s00025-012-0232-3.pdf
Reference28 articles.
1. Agawal R.P.: Boundary Value Problems for Higher Order Differential Equations. World Scientific, Singapore (1986)
2. Du Z., Lin X., Ge W.: On a third order nonliear boundary value problem at resonance. J. Math. Anal. Appl. 302, 217–229 (2005)
3. Du Z., Lin X., Ge W.: Some higher-order multi-point boundary value problem at resonance. J. Comput. Appl. Math. 177, 55–65 (2005)
4. Feng W., Webb J.R.L.: Solvability of three-point boundary value problems at resonance. Nonlinear Anal. 30, 3227–3238 (1997)
5. Graef J.R., Kong L., Yang B.: Existence of solutions for a higher order multi-point boundary value problem. Results Math. 53, 77–101 (2009)
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