1. P. C. S. Rao, P. K. Jana and H. A. Banka., Wirel. Netw., 23, No. 7, 2005–2020 (2017).
2. T. Kang and S. F. Wei, Int. Tech. Sens., No.1, 122–125 (2019)
3. D. F. Zhong, J. J. Xue, F. He, et al., Chin. High Technol. Lett., 27, No. 6, 530–536 (2017).
4. Y. W. Du, K. Feng and Y. X. Lian, J. Chin. Comput. Syst., 38, No. 10, 2221–2225 (2017).
5. W. He, H. Ling, Z. Zhang, et al., Int. J. Geogr. Inform. Sci., 32, No. 4, 827–846 (2018).