Stresses in a bonded wafer

Author:

Parks Vincent J.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Aerospace Engineering

Reference8 articles.

1. ASTM D2095-72, “Standard Test Method for Tensile Strength of Adhesives by Means of Bar and Rod Specimens,” Annual Book of Amer. Soc. for Test. Mat. Stand., Part 22 (reapproved 1978).

2. Adams, R.D., Coppendale, J. and Peppiatt, N.A., “Stress Analysis of Axisymmetric Butt Joints Loaded in Torsion and Tension,”J. Strain Analysis,13 (1), (1978).

3. Kuenzi, E.W. and Stevens, G.H., “Determination of Mechanical Properties of Adhesives for Use in the Design of Bonded Joints,” Forest Prod. Lab., Rep. FPL-011 (1963).

4. Kinloch, A.J., “The Science of Adhesion, Part 2 Mechanics and Mechanisms of Failure,” J. Mat. Sci.,17 (1982).

5. Lindsey, G.H., “Triaxial Fracture Studies,”J. Appl. Physics,13,4843–4852 (1967).

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1. Delamination Mechanics;Springer Handbook of Experimental Solid Mechanics;2008

2. Ceramic Coating Edge Failure Due to Thermal Expansion Interference;Journal of Engineering for Gas Turbines and Power;1998-10-01

3. APPLICATION OF STRAIN GAGES TO MEASURE ADHESIVE STRAINS THROUGH THE THICKNESS OF AN ADHESIVELY -BONDED STIFFENED STRIP;Experimental Techniques;1991-03

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