Distributions of Electromagnetic Fields and Forced Flow and Their Relevance to the Grain Refinement in Al–Si Alloy Under the Application of Pulsed Magneto-Oscillation-Reference-Cited by-同舟云学术

Distributions of Electromagnetic Fields and Forced Flow and Their Relevance to the Grain Refinement in Al–Si Alloy Under the Application of Pulsed Magneto-Oscillation

Published:2021-05-09 Issue:2 Volume:35 Page:254-274
ISSN:1006-7191
Container-title:Acta Metallurgica Sinica (English Letters)
language:en
Short-container-title:Acta Metall. Sin. (Engl. Lett.)

Author:

Xu Yan-Yi,Zhao Jing,Ye Chun-Yang,Shen Yan-Ping,Miao Xin-Cheng,Zhang Yun-Hu,Zhai Qi-Jie

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Metals and Alloys

Link

https://link.springer.com/content/pdf/10.1007/s40195-021-01242-0.pdf

Reference38 articles.

1. R.G. Guan, D. Tie, Acta Metall. Sin. Engl. Lett. 30, 409 (2017)

2. J.G. Jung, T.Y. Ahn, Y.H. Cho, S.H. Kim, J.M. Lee, Acta Mater. 144, 31 (2018)

3. N. Li, L.M. Zhang, R. Zhang, P.F. Yin, Metals 9, 571 (2019)

4. T. Ahmed, H.X. Jiang, W. Li, J.Z. Zhao, Acta Metall. Sin. Engl. Lett. 31, 842 (2018)

5. D. Räbiger, Y.H. Zhang, V. Galindo, S. Franke, Acta Mater. 79, 327 (2014)

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