The □ b -Heat Equation on Quadric Manifolds
Author:
Publisher
Springer Science and Business Media LLC
Subject
Geometry and Topology
Link
http://link.springer.com/content/pdf/10.1007/s12220-010-9146-z.pdf
Reference20 articles.
1. Berndtsson, B.: Weighted estimates for $\overline{\partial}$ in domains in ℂ. Duke Math. J. 66(2), 239–255 (1992)
2. Beals, R., Gaveau, B., Greiner, P.: The Green function of model step two hypoelliptic operators and the analysis of certain tangential Cauchy Riemann complexes. Adv. Math. 121(2), 288–345 (1996)
3. Beals, R., Gaveau, B., Greiner, P.C.: Hamilton-Jacobi theory and the heat kernel on Heisenberg groups. J. Math. Pures Appl. (9) 79(7), 633–689 (2000)
4. Boggess, A., Raich, A.: A simplified calculation for the fundamental solution to the heat equation on the Heisenberg group. Proc. Am. Math. Soc. 137(3), 937–944 (2009)
5. Calin, O., Chang, D.-C., Tie, J.: Fundamental solutions for Hermite and subelliptic operators. J. Anal. Math. 100, 223–248 (2006)
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