Optimized Operation Methods of the Wafer Surface Defect Detection
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Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s42979-024-03076-w.pdf
Reference19 articles.
1. Chen S-H, Kang C-H, Perng DB. Detecting and measuring defects in wafer die using GAN and YOLOv3. Appl Sci. 2020;10(8725):1–15.
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5. Lin J, Keogh E, Lonardi S, Chiu B. A symbolic representation of time series with implications for streaming algorithms. In: Proceedings of 8th ACMSIGMOD workshop research issues data mining knowledge, discovery. 2003. p. 211.
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