Smart Cut Technology: The Path for Advanced SOI Substrates-Reference-Cited by-同舟云学术

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Smart Cut Technology: The Path for Advanced SOI Substrates

Published:2005 Issue: Volume: Page:39-52
ISSN:1568-2609
Container-title:Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment
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Author:

Moriceau H.,Lagahe-Blanchard C.,Fournel F.,Pocas S.,Jalaguier E.,Perreau P.,Deguet C.,Ernst T.,Beaumont A.,Kernevez N.,Hartman J.M.,Ghyselen B.,Aulnette C.,Letertre F.,Rayssac O.,Faure B.,Richtarch C.,Cayrefourq I.

Publisher

Springer Netherlands

Link

http://link.springer.com/content/pdf/10.1007/1-4020-3013-4_4

Reference11 articles.

1. M. Bruel, Electron. Lett., 31(14), 1201, (1995)

2. D. Lederer, C. Desrumeaux, François Brunier and J.-P. Raskin, 2003 IEEE Intern. SOI Conference (2003)

3. O. Rayssac, H. Moriceau, M. Olivier, I. Stoemenos, A. M. Cartier, B. Aspar, SOI Technology and Devices X, Electrochemical Society Proceedings, PV 01-03, 39, (2001)

4. C. Maleville, O. Rayssac, H. Moriceau, B. Biasse, L. Baroux, B. Aspar and M. Bruel, Semiconductor wafer bonding, Science Technology and Applications IV, Electrochemical Society Proceedings, PV 97-36, 46 (1998)

5. M. Nishida, M. Okuyama and Y. Hamakawa, Appl. Surf. Sc., 79/80, 409, (1994)

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