Author:
Men Yutao,Wang Shibin,Li Lin’an
Publisher
Springer Science and Business Media LLC
Reference15 articles.
1. Zhou Zhaoying, Ye Xiongying, Cui Tianhong et al. Microtechnology/nanotechnology and MEMS [J]. Optics and Precision Engineering, 1998, 6(1): 1–7(in Chinese).
2. Li T, Suo Z. Deformability of thin metal films on elastomer substrates[J]. International Journal of Solids and Structures, 2006, 43(7/8): 2351–2363.
3. Siegel A C, Phillips S T, Dickey M D et al. Foldable printed circuit boards on paper substrates[J]. Advanced Functional Materials, 2010, 20(1): 28–35.
4. Keller R R, Phelps J M, Read D T. Tensile and fracture behavior of free-standing copper films [J]. Materials Science and Engineering: A, 1996, 214(1/2): 42–52.
5. Kang Y S. Microstructure and Strengthening Mechanisms in Aluminum Thin Film on Polyimide Substrate[D]. University of Texas at Austin, Austin, Texas, USA, 1996.
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献