Author:
Wang Shaoyu,Wang Zijie,Wang Shuolin,Yang Yanru,Huang Congliang,Wang Xiaodong
Publisher
Springer Science and Business Media LLC
Reference46 articles.
1. Bonn D., Eggers J., Indekeu J., Meunier J., Rolley E., Wetting and spreading. Reviews of Modern Physics, 2009, 81(2): 739–805.
2. Sun Y., Webb III E.B., The atomistic mechanism of high temperature contact line advancement: results from molecular dynamics simulations. Journal of Physics: Condensed Matter, 2009, 21: 46413.
3. Kim C., Kang S.C., Baldwin D.F., Experimental evaluation of wetting dynamics models for Sn63Pb37 and SnAg4.0Cu0.5 solder materials. Journal of Applied Physics, 2008, 104: 033537.
4. Yin L., Chauhan A., Singler T.J., Reactive wetting in metal/metal systems: dissolutive versus compound-forming systems. Materials Science and Engineering A, 2008, 495: 80–89.
5. Su S., Yin L., Sun Y., Murray B.T., Singler T.J., Modeling dissolution and spreading of Bi-Sn alloy drops on a Bi substrate. Acta Materialia, 2009, 57: 3110–3122.