1. H. Tagusari, Y. Hirasawa, et al, “Electrodeposited Copper Foil for Printed Wiring Board and Method for Manufacturing the Same,” U.S. patent 5,897,761 (24 July 1999).
2. ML. Khazin, “Structure and Morphology of the Surface of Copper Foil,”Russian J. Appl. Chem., 68 (5), Part 1 (1995).
3. A.J.B. Dutra and T.J. O’Keefe, “Copper Nucleation on Titanium for Thin Film Applications,”J. Appl. Electrochem., 29 (1999), pp. 1217–1227.
4. H.D. Merchant, “Defect Structure of Electrodeposits,”Defect Structure, Morphology and Properties of Deposits, ed. H.D. Merchant (Warrendale, PA: TMS, 1995), pp. 1–59.
5. J.-L. Delplancke et al., “Production of Thin Copper Foils on Microporous Titanium Oxide Substrates,”Hydrometall., 24 (1990), pp. 179–187.