A technology for implantable hermetic packages. Part 1: Design and materials
Author:
Publisher
Springer Science and Business Media LLC
Subject
Computer Science Applications,Biomedical Engineering
Link
http://link.springer.com/content/pdf/10.1007/BF02441301.pdf
Reference9 articles.
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3. Donaldson, P. E. K. andSayer, E. (1975) A vacuum centrifuge for void-free potting of implantable hybrid microcircuits in silicone.Med. & Biol. Eng.,13, 595–596.
4. Donaldson, P. E. K. (1976) The Encapsulation of microelectronic devices for long-term surgical implantation.IEEE Trans.,BME-23, 281–285.
5. Donaldson, P. E. K. andSayer, E. (1977) Silicone rubber adhesives as encapsulants for microelectronic implants.Med. & Biol. Eng. & Comput.,15, 712–715.
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