An electron moiré method for a common SEM
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Computational Mechanics
Link
http://link.springer.com/content/pdf/10.1007/s10409-006-0038-1.pdf
Reference19 articles.
1. Kishimoto S., Egashira M., Shinya N., Carolan R.A.: Local micro-deformation analysis by means of micro-grid and electron beam moiré fringe method. In: Jono M., Inoue T. (eds.) Proceedings of 6th International Conference on Mechanical Behavior of Materials, vol. 4, pp. 661–666 (1991)
2. Read D.T., Dally J.W. (1994) Electron-beam moire study of fracture of a glass fiber reinforced plastic composite. J. Appl. Mech-T ASME 61(2): 402–409
3. Dally J.W., Read D.T. (1993) Electron-beam moire. Exp. Mech. 33(4): 270–277
4. Post D., Han B., Ifju P. (1994) High sensitivity Moiré. Springer, Berlin Heidelberg New York, pp. 85–134
5. Durelli A.J., Daniel I.M. (1961) A nondestructive three-dimensional strain analysis method. J. Appl. Mech. 28(1): 83–96
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