Thermal residual stresses in functionally graded and layered 6061 Al/SiC materials-Reference-Cited by-同舟云学术

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Thermal residual stresses in functionally graded and layered 6061 Al/SiC materials

Published:1996-10 Issue:10 Volume:27 Page:3241-3249
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:MMTA

Author:

Ho S.,Lavernia E. J.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF02663874.pdf

Reference20 articles.

1. M. Koizumi:Proc. 16th Ann. Conf. Composites and Adv. Ceram. Mater., The American Ceramic Society, Westerville, OH, 1992, pp. 333–7.

2. L.M. Shepard:Am. Ceram. Soc. Bull, 1992, vol. 71, pp. 617–31.

3. R.G. Ford:Mater. Processing Rep., 1992, vol. 7, pp. 1–5.

4. K. Atarashiya, K. Kurokawa, and N. Tadao:Ceram. Eng. Sci. Proc., 1992, vol. 13, pp. 400–07.

5. E.J. Lavernia, J.A. Ayers, and T.S. Srivatsan:Int. Mater. Rev., 1992, vol. 37, pp. 1–44.

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