RA-ECDM of Silicon Wafers Using Taguchi’s Methodology and Machine Learning Algorithms
Author:
Funder
Science and Engineering Research Board, DST, India
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s12633-022-02128-1.pdf
Reference39 articles.
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4. Pan Y, Miller C, Trepka K, Tao Y (2018) Wafer-scale photolithography of ultra-sensitive nanocantilever force sensors. Appl Phys Lett 113(8):083103
5. Zhang Y, Han N, Kang X, Zhao W (2016) An experimental study on the effect of parameters on the depth of crater machined by electrostatic field–induced electrolyte jet micro electrical discharge machining. Adv Mech Eng 8(4):1687814016643886
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