Particles Manipulation to Improve Removal Efficiency of Fused Silica in Chemical Mechanical Polishing
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s12633-023-02565-6.pdf
Reference38 articles.
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2. Roy R, Agrawal DK, McKinstry HA (1989) Very low thermal expansion coefficient material. Annu Rev Maler Sci 19:59–81. https://doi.org/10.1146/annurev.ms.19.080189.000423
3. Campbell JH, Hawley-Fedder RA, Stolz CJ, Menapace JA, Borden MR, Whitman PK, Yu J, Runkel M, Riley MO, Feit MD, Hackel RP (2004) NIF optical materials and fabrication technologies: an overview. Proc SPIE 5341:84–101. https://doi.org/10.1117/12.538471
4. Kang CX, Gao B, Guo D, Luo HM, Pan GS (2020) The cycle characteristics of slurries in chemical mechanical polishing (CMP) of fused silica. Chem Select 5:9350–9356. https://doi.org/10.1002/slct.202000926
5. Balagopalan S, Rasheed IA, Sharma H, Chhabra IM, Gupta MK, Manimaran P, Karthikeyan B (2022) Fractal and multifractal analysis on fused silica glass formed by bound abrasives grain mediated grinding using diamond grits. J Non-Cryst Solids 581:121418. https://doi.org/10.1016/j.jnoncrysol.2022.121418
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