Surface Texturing Behavior of Nano-Copper Particles under Copper-Assisted Chemical Etching with Various Copper Salts System-Reference-Cited by-同舟云学术

Surface Texturing Behavior of Nano-Copper Particles under Copper-Assisted Chemical Etching with Various Copper Salts System

Published:2021-10-28 Issue: Volume: Page:
ISSN:1876-990X
Container-title:Silicon
language:en
Short-container-title:Silicon

Author:

Hong Shihao,Zou Yuxin,Ma Liang,Chen Xiuhua,Li Shaoyuan^ORCID,Ma Wenhui,Chang Yuanchih

Funder

National Natural Science Foundation of China

National Key R&D Program of China

Key Technologies Research and Development Program

Major Science and Technology Projects in Yunnan Province

Key Project of Yunnan Province Natural Science Fund

Yunnan Ten Thousand Talents Project

the Program for Innovative Research Team in University of Ministry of Education of China

Publisher

Springer Science and Business Media LLC

Subject

Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s12633-021-01359-y.pdf

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