Copper microwires spun from the melt-Reference-Cited by-同舟云学术

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Copper microwires spun from the melt

Published:1974-01 Issue:1 Volume:9 Page:74-80
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Manfr� G.,Servi G.,Ruffino C.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF00554757.pdf

Reference14 articles.

1. C. E. Anagnostopaulos,Rubber J. 152 (1970) 23.

2. D. L. King,Metals 2 (1967) 33.

3. US Patent 2.825.108 (R. B. Pond) (1958).

4. US Patent 3.362.803 (Secretary of Defence, Fed. Rep. Germany) (1968).

5. G. Manfr� andD. Vianello, Italian Patent 930.409 (Montedison S.p.A.) (1972).

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Shape memory and superelasticity in polycrystalline Cu–Al–Ni microwires;Applied Physics Letters;2009-10-26

2. Rapid Solidification;Materials Science and Technology;2006-09-15

3. Production, properties and applications of microwire and related products;Journal of Materials Science;1987-08

4. The status of rapid solidification of alloys in research and application;Journal of Materials Science;1984-04

5. Experimental Methods in Rapid Quenching from the Melt;Ultrarapid Quenching of Liquid Alloys;1981

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