Author:
Zhang Chong,Salama Islam A.,Quick Nathaniel R.,Kar Aravinda
Publisher
Springer Science and Business Media LLC
Reference20 articles.
1. Lee Y.C., Chen W.T. (1998). Manufacturing Challenges in Electronic Packaging. Chapman & Hall, New York, p. 47
2. Azar K. (1997). Thermal Measurements in Electronics Cooling. CRC Press, New York, p. 243
3. Azar K., Graebner J. E. (1996). Proc. IEEE Semicond. Thermal Meas. Manage. Symp. IEEE, Austin, Texas, p. 169
4. Morikawa J., Hashimoto T. (1997). Polymer 38:5397
5. Parker W.J., Jenkins R.J., Butler C.P., Abbott G.L. (1961). J. Appl. Phys. 32:1679
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