1. K. G. Degen, S. Rossetto, R. Caps, and J. Fricke, Thermal Conductivity 22, T. W. Tong, ed. (Technomic Publ. Co. Inc., Lancaster/Basel, 1994), pp. 401–412.
2. P. P. Gervais and D. Goumy, Insulating Material with Low Thermal Conductivity, formed of a Compacted Granular Structure, US-Patent 4,159,359 (June 26, 1979).
3. Fischer W., Haar W., (1978). Physik in unserer Zeit 9:184.
4. Caps R., Fricke J., Reis H., (1983). High Temps. – High Press. 15:225
5. R. Reuter and G. Sextl, Degussa AG, Hanau, “Vacuum Insulation Panels (VIPs),” at 1993 Non-Fluorocarbon Insulation, Refrig. and Air-Conditioning Technol. Workshop, Wiesbaden (1993).