Author:
Wang Weishu,Gao Yanshang,Niu Jingzun,Wang Yuzheng,Li Renjie,Wang Jie
Publisher
Springer Science and Business Media LLC
Reference21 articles.
1. J. Zhao, M.S. Du, Z. Zhang et al., Thermal management strategy for electronic chips based on combination of a flat-plate heat pipe and spray cooling. Int. J. Heat Mass Transf. 181, 121894 (2021)
2. H.H. Dong, L. Ruan, Y. Wang et al., Performance of air/spray cooling system for large-capacity and high-power-density motors. Appl. Therm. Eng. 192, 116925 (2021)
3. J. Wang, Analysis of heat dissipation technology of electronic equipment. Electron. Technol. 51(07), 184–185 (2022)
4. S. Luhar, D. Sarkar, A. Jain et al., Steady state and transient analytical modeling of non-uniform convective cooling of a microprocessor chip due to jet impingement. Int. J. Heat Mass Transf. 110, 768–777 (2017)
5. C.H. Wang, D.S. Zhu, Research progress on thermoelectric cooling technology applied in electronic packaging thermal management. Electron. Comp. Mater. 27(11), 4–7 (2008)
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