1. Pryputniewicz RJ (2007) “MEMS: recent advances and current challenges”, Fracture of nano and engineering materials and structures (ECF16). Springer, Dordrecht, p 21
2. Hansen DS, Marinis TF, Furlong C, Pryputniewicz RJ (2001) Advances in optimization of MEMS inertial sensor packaging. Proc. Internat. Congress on Exp. and Appl. Mech. for Emerging Technologies, SEM, Bethel, CT, pp 821–825
3. Sumali A, Epp DS, Filcher CW (2004) The use of modal analysis as part of quality control in micro fabricated devices. Proc. XXIII Internat. Modal Analysis Conf. (IMAC-XXIII), Orlando, FL, pp 410–416
4. Marinis TF, Soucy JW, Hanson DS, Pryputniewicz RJ, Marinis RT, Klempner AR (2006) Isolation of MEMS devices from package stresses by use of compliant metal interposers. Proc. 56th IEEE Electronic Components & Technology Conf. (56th-IEEE-ECTC), paper No. P1S25-MEMS, San Diego, CA
5. Duesterhaus MA, Bateman VI, Hoke DA (2004) Shock testing of MEMS devices. Proc. 4th Internat. Symp. on MEMS and Nanotechnology (4th-ISMAN), Costa Mesa, CA, pp 104–109