Simulation and Experimental Validation of the Cure Process of an Epoxy-Based Encapsulant
Author:
Funder
Rafael - Advanced Defense Systems, ltd.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Aerospace Engineering
Link
https://link.springer.com/content/pdf/10.1007/s11340-023-01000-6.pdf
Reference30 articles.
1. Lee H, Neville K (1967) Handbook of epoxy resins
2. Ardebili H, Zhang J, Pecht MG (2018) Encapsulation technologies for electronic applications (William Andrew)
3. Bogetti TA, Gillespie JW Jr (1992) Process-induced stress and deformation in thick-section thermoset composite laminates. J Compos Mater 26(5):626–660
4. Svanberg JM, Holmberg JA (2001) An experimental investigation on mechanisms for manufacturing induced shape distortions in homogeneous and balanced laminates. Compos Part A: Appl Sci Manufac 32(6):827–838
5. Svanberg JM, Holmberg JA (2004) Prediction of shape distortions part I: FE-implementation of a path dependent constitutive model. Compos Part A: Appl Sci Manufac 35(6):711–721
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