1. L.F. Miller, “Controlled Collapse Reflow Chip Joining,” IBM Journal of Research and Development, 13 (1969).
2. L.S. Goldmann, “Geometric Optimization of Controlled Collapse Interconnections,” IBM Journal of Research and Development, 13 (1969).
3. N. Basavanhally, “Application of Soldering Technologies for Opto-electronic Component Assembly,” ASME Interna-tional Electronic Packaging Conference (New York: ASME, 1993), pp. 1149–1155.
4. R.A. Nordin et al., “High Performance Optical Data Link Array Technology,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 16(8), pp. 783–788.
5. MJ. Wale and C. Edge, “Self-Aligned, Flip Chip Assembly of Photonic Devices with Electrical and Optical Connections,” IEEE Transactions on Components, Hybrids and Manufacturing Technology, CHMT-13 (4) (1990), pp. 780–786.