Author:
Zhang Xin,Li Ru-Chun,Zheng Qi
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials
Reference13 articles.
1. Tuckerman DB, Pease RFW (1981) High performance heat sinking for VLSI. IEEE Electron Device Lett 2(5):126–129
2. Liu L, Zhang GQ, Yang DG, Pan KL, Zhong H, Hou FZ (2010) Thermal analysis and comparison of heat dissipation methods on high-power LEDs. In: IEEE high density packaging
3. Li RC (2010) Research on thermal resistance of high-power LED arrays based on microchannel cooler. Semicond Optoelectron 31(4):8
4. Mao ZM (2012) Thermal modeling and design for microchannel cold plate with high temperature uniformity subjected to multiple heat sources. Int Commun Heat Mass Transf 39(6):781–785
5. Ge J, He W (2008) Thermal analysis and simulation for hydro-cooling-heat sink of transistors. Mach Tool Hydraul (5):161–164
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13 articles.
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