Integrated color defect detection method for polysilicon wafers using machine vision

Author:

Zhang Zai-Fang,Liu Yuan,Wu Xiao-Song,Kan Shu-Lin

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials

Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Wafer Map Defect Recognition and Accurate Localization Based on Defect Completion Algorithm;2023 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM);2023-06-09

2. An Efficient AI-Based Classification of Semiconductor Wafer Defects using an Optimized CNN Model;2023 IEEE IAS Global Conference on Emerging Technologies (GlobConET);2023-05-19

3. Color Classification Under Complex Background via Genetic Algorithm-Based Color Difference Histogram;IEEE Transactions on Semiconductor Manufacturing;2023-02

4. A full-flow inspection method based on machine vision to detect wafer surface defects;Mathematical Biosciences and Engineering;2023

5. Improved Defect Detection in Photovoltaic Panels Through Deep Learning and Decision Tree-Based Classifiers;SSRN Electronic Journal;2023

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