Thermal incompatibility analysis of Cu-etching solution in a metal-etching system using adiabatic calorimetry
Author:
Funder
China Medical University, Taiwan
Publisher
Springer Science and Business Media LLC
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics
Link
https://link.springer.com/content/pdf/10.1007/s10973-022-11650-8.pdf
Reference20 articles.
1. Çakir O, Yardimeden A, Özben T. Chemical machining. Arch Mater Sci Eng. 2007;28:499–502.
2. Jang KS, Suk HJ, Kim WS, Ahn T, Ka JW, Kim J, Yi MH. Direct photo-patternable, low-temperature processable polyimide gate insulator for pentacene thin-film transistors. Org Electron. 2012;13(9):1665–70.
3. Allen DM, Almond HJ. Characterisation of aqueous ferric chloride etchants used in industrial photochemical machining. J Mater Process Techno. 2004;149(1–3):238–45.
4. Yazici EY, Deveci H. Cupric chloride leaching (HCl–CuCl2–NaCl) of metals from waste printed circuit boards (WPCBs). Int J Miner Process. 2015;134:89–96.
5. Shu CM, Yang YJ. Using VSP2 to separate catalytic and self-decomposition reactions for hydrogen peroxide in the presence of hydrochloric acid. Thermochim Acta. 2002;392:259–69.
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