Thermal and mechanical analysis of injection moulded poly(lactic acid) filled with poly(ethylene glycol) and talc
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Publisher
Springer Science and Business Media LLC
Link
http://link.springer.com/content/pdf/10.1007/s10973-014-4037-3.pdf
Reference30 articles.
1. Ren X. Biodegradable plastics: a solution or a challenge? J Clean Prod. 2003;11:27–40.
2. Lim LT, Auras R, Rubino M. Processing technologies for poly(lactic acid). Prog Polym Sci. 2008;33:820–52.
3. Goswami J, Bhatnagar N, Mohanty S, Ghosh AK. Processing and characterization of poly(lactic acid) based bioactive composites for biomedical scaffold application. Express Polym Lett. 2013;7:767–77.
4. Iwatake A, Nogi M, Yano H. Cellulose nanofiber-reinforced polylactic acid. Compos Sci Technol. 2008;68:2103–6.
5. Ganster J, Fink HP, Pinnow M. High-tenacity man-made cellulose fibre reinforced thermoplastics—injection moulding compounds with polypropylene and alternative matrices. Compos Part A. 2006;37:1796–804.
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