Correlation between unsteady-state solidification thermal parameters and microstructural growth of Zn–8 mass% Al and Zn–8 mass% Al–XBi tribological alloys
Author:
Funder
Fundação de Amparo à Pesquisa do Estado de São Paulo
Coordenação de Aperfeiçoamento de Pessoal de Nível Superior
Publisher
Springer Science and Business Media LLC
Link
http://link.springer.com/content/pdf/10.1007/s10973-019-08600-2.pdf
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3. Pola A, Montesano L, Gelfi M, La Vecchia GM. Comparison of the sliding wear of a novel Zn alloy with that of two commercial Zn alloys against bearing steel and leaded brass. Wear. 2016;368–369:445–52.
4. Silva BL, Cheung N, Garcia A, Spinelli JE. Thermal parameters, microstructure, and mechanical properties of directionally solidified Sn–0.7 wt% Cu solder alloys containing 0 ppm to 1000 ppm Ni. J Electron Mater. 2013;42:179–91.
5. Bertelli F, Brito C, Ferreira IL, Reinhart G, Nguyen-Thi H, Mangelinck-Noël N, Cheung N, Garcia A. Cooling thermal parameters, microstructure, segregation and hardness in directionally solidified Al–Sn–(Si;Cu) alloys. Mater Des. 2015;72:31–42.
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