Numerical simulation of thermal wave propagation and collision in thin film using finite element solution
Author:
Publisher
Springer Science and Business Media LLC
Link
http://link.springer.com/content/pdf/10.1007/s10973-020-09346-y.pdf
Reference30 articles.
1. Tzou DY. The generalized lagging response in small-scale and high-rate heating. Int J Heat Mass Transf. 1995;38(17):3231–40.
2. Cattaneo C. Sur une forme de l’equation de la chaleur eliminant le paradoxed’inepropagation instantanee. C R Acad Sci. 1958;247:431–3.
3. Vernotte P. Les paradoxes de la theorie continue de l’equation de la chaleur. C R Acad Sci. 1958;246(22):3154–5.
4. Bai C, Lavine AS. On hyperbolic heat conduction and the second law of thermodynamics. J Heat Transf. 1995;117:256–63.
5. Ozisik MN, Tzou DY. On the wave theory in heat conduction. J Heat Transf. 1994;116(3):526–35.
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Reduced-Order FEM Based on POD for Solving Non-Fourier Heat Conduction Problems under Laser Heating;Coatings;2024-04-17
2. A general numerical method for solving the three-dimensional hyperbolic heat conduction equation on unstructured grids;Computers & Mathematics with Applications;2024-03
3. Numerical analysis of non-Fourier heat conduction dynamics in the composite layer;Journal of Mechanical Engineering and Sciences;2023-09-27
4. Analytical model for ultrashort pulse laser heating in a titanium nanofilm by implementing dual-phase-lag theory in mathematical analysis;Journal of Thermal Analysis and Calorimetry;2021-09-12
5. A COMPARATIVE STUDY OF DIFFUSION, THERMAL WAVE AND DUAL-PHASE-LAG HEAT CONDUCTION IN THIN LAYER;Isı Bilimi ve Tekniği Dergisi;2021-08-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3