Author:
Gracia-Fernández C.,Tarrío-Saavedra J.,López-Beceiro J.,Gómez-Barreiro S.,Naya S.,Artiaga R.
Publisher
Springer Science and Business Media LLC
Reference30 articles.
1. Petrie EM. Epoxy adhesive formulations. New York: McGraw-Hill; 2006.
2. Paz-Abuín S. Epoxy adhesives: a view of the present and the future. In: Pascault JP, Willians RJJ, editors. Epoxy Polymers. Weinheim: Wiley-VCH; 2010. p. 215–33.
3. Costantino S, Waldvogel U. Composite processing: state of the art and future trends. In: Pascault JP, Willians RJJ, editors. Epoxy Polymers. Weinheim: Wiley-VCH; 2010. p. 271–87.
4. Hayes BS, Gilbert EN, Seferis JC. Scaling complications of dual temperature cure resin prepreg systems in airplane part manufacture. Compos Pt A-Appl Sci Manuf. 2000;31:717–25.
5. Pascault JP, Sautereau H, Verdu J, Williams RJJ. Thermosetting polymers. New York: Marcel Dekker; 2002.
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献