Author:
Pérez J. M.,Rodríguez F.,Alonso M. V.,Oliet M.,Domínguez J. C.
Publisher
Springer Science and Business Media LLC
Reference38 articles.
1. Forss KG, Fuhrmann A. Finnish plywood, particleboard, and fireboard made with a lignin-base adhesive. Forest Prod J. 1979;29(7):39–43.
2. Vázquez G, González-Álvarez J, López-Suevos F, Freire S, Antorrena G. Curing kinetics of tannin–phenol–formaldehyde adhesives as determined by DSC. J Therm Anal Calorim. 2002;70(1):19–28.
3. Calvé LR, Shields JA, Blanchette L, Fréchet JMJ. A practical lignin-based adhesive for waferboard/OSB. Forest Prod J. 1988;38(5):15–20.
4. Alonso MV, Rodríguez JJ, Oliet M, Rodríguez F, García J, Gilarranz MA. Characterization and structural modification of ammonic lignosulfonate by methylolation. J Appl Polym Sci. 2001;82(11):2661–8.
5. Allan GG, Dalan JA, Foster NC. Modification of lignins for use in phenolic resins. In: Adhesives from renewable resources. American Chemical Society, Symposium Series; 1989.
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