Effects of Ag addition on phase transitions, microstructures and solder/copper interfaces of Sn99.1−xCu0.9Agx alloys
Author:
Funder
Fundação de Amparo à Pesquisa do Estado de São Paulo
Publisher
Springer Science and Business Media LLC
Link
http://link.springer.com/content/pdf/10.1007/s10973-018-7893-4.pdf
Reference22 articles.
1. Yao P, Li X, Liang X, Yu B, Jin F, Li Y. A study on interfacial phase evolution during Cu/Sn/Cu soldering with a micro interconnected height. Mater Charact. 2017;131:49–63.
2. Dutta Chowdhury N, Ghosh KS. Calorimetric studies of Ag–Sn–Cu dental amalgam alloy powders and their amalgams. J Therm Anal Calorim. 2017. https://doi.org/10.1007/s10973-017-6438-6 .
3. Xian JW, Belyakov SA, Ollivier M, Nogita K, Yasuda H, Gourlay CM. Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections. Acta Mater. 2017;126:540–51.
4. Tang Y, Luo SM, Huang WF, Pan YC, Li GY. Effects of Mn nanoparticles on tensile properties of low-Ag Sn–0.3Ag–0.7Cu–xMn solder alloys and joints. J Alloys Compd. 2017;719:365–75.
5. Shang H, Ma ZL, Belyakov SA, Gourlay CM. Grain refinement of electronic solders: the potential of combining solute with nucleant particles. J Alloys Compd. 2017. https://doi.org/10.1016/j.jallcom.2017.04.268 .
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys;Journal of Thermal Analysis and Calorimetry;2024-05
2. Thermal conductance at Sn-0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth;Journal of Thermal Analysis and Calorimetry;2021-06-20
3. Effects of Cr addition on the constitutive equation and precipitated phases of copper alloy during hot deformation;Materials & Design;2020-06
4. Effect mechanism of Ag and Bi elements on the corrosion process in Sn–9Zn–1Ag and Sn–9Zn–3Bi solders;Materials Research Express;2019-10-18
5. Metallic sample preparation for phase transformation analysis;MethodsX;2019
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3