Effects of Ag addition on phase transitions, microstructures and solder/copper interfaces of Sn99.1−xCu0.9Agx alloys
Author:
Funder
Fundação de Amparo à Pesquisa do Estado de São Paulo
Publisher
Springer Science and Business Media LLC
Link
http://link.springer.com/content/pdf/10.1007/s10973-018-7893-4.pdf
Reference22 articles.
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2. Dutta Chowdhury N, Ghosh KS. Calorimetric studies of Ag–Sn–Cu dental amalgam alloy powders and their amalgams. J Therm Anal Calorim. 2017. https://doi.org/10.1007/s10973-017-6438-6 .
3. Xian JW, Belyakov SA, Ollivier M, Nogita K, Yasuda H, Gourlay CM. Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections. Acta Mater. 2017;126:540–51.
4. Tang Y, Luo SM, Huang WF, Pan YC, Li GY. Effects of Mn nanoparticles on tensile properties of low-Ag Sn–0.3Ag–0.7Cu–xMn solder alloys and joints. J Alloys Compd. 2017;719:365–75.
5. Shang H, Ma ZL, Belyakov SA, Gourlay CM. Grain refinement of electronic solders: the potential of combining solute with nucleant particles. J Alloys Compd. 2017. https://doi.org/10.1016/j.jallcom.2017.04.268 .
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3. Effect mechanism of Ag and Bi elements on the corrosion process in Sn–9Zn–1Ag and Sn–9Zn–3Bi solders;Materials Research Express;2019-10-18
4. Metallic sample preparation for phase transformation analysis;MethodsX;2019
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