Thermal management of microelectronic devices using micro-hole cellular structure and nanofluids

Author:

Tariq Hussain Ahmed,Shoukat Ahmad Adnan,Hassan Muhammad,Anwar MuhammadORCID

Publisher

Springer Science and Business Media LLC

Reference52 articles.

1. Tariq HA, Shoukat AA, Anwar M, Israr A, Ali HM. Water cooled micro-hole cellular structure as a heat dissipation media: an experimental and numerical study. Therm Sci. 2018; http://www.doiserbia.nb.rs/Article.aspx?ID=0354-98361800184T . Accessed 08 Oct 2018

2. Ahmed HE, Salman BH, Kherbeet AS, Ahmed MI. Optimization of thermal design of heat sinks; a review. Int. J Heat Mass Transf. 2018;118:129–53.

3. Li HY, Chao SM. Measurement of performance of plate-fin heat sinks with cross flow cooling. Int J Heat Mass Transf. 2009;52(13–14):2949–55.

4. Gochman S, Ronen R, Anati I, Berkovits A, Kurts T, Naveh A, et al. The intel pentium M processor: micro architecture and performance. Int Technol J. 2003;7:21–36.

5. Tuckerman DB, Pease RF. High performance heat sink for VLST. IEEE Electron Device Lett EDL. 1981;2:126–9.

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