Author:
Sahoo Prasanta,Pal Sujan Kumar
Publisher
Springer Science and Business Media LLC
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials
Reference22 articles.
1. Brenner, A., Riddell, G.E.: Nickel plating by chemical reduction. US Patent US2532282, 1950
2. Riedel, W.: Electroless Nickel Plating. Finishing Publications Ltd., UK (1991)
3. Allen, R.M., Vandersande, J.B.: The structure of electroless Ni-P films as a function of composition. Scripta Metall. 16(10), 1161–1164 (1982)
4. Berkh, O., Eskin, S., Zahavi, J.: Properties of electrodeposited Ni-P – SiC composite coatings. Metal Finish. 94, 35–40 (1996)
5. Baudrand, D., Bengston, J.: Electroless plating processes: developing technologies for electroless nickel, palladium, and gold. Metal Finish. 93(9), 55–57 (1995)
Cited by
55 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献