Luminescent Molecular Sensors for Assessment of Temperature Field in Machining

Author:

Murthy Tejas G.,Madariaga Jon,Huang Chih-Yung

Publisher

Springer Science and Business Media LLC

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials

Reference27 articles.

1. Boothroyd, G.: Temperatures in orthogonal metal cutting. Proc. Inst. Mech. Eng. 177, 789–810 (1963). doi: 10.1243/PIME_PROC_1963_177_058_02

2. Shaw, M.C.: Metal cutting principles. Oxford University Press, New York (2005)

3. Davies, M., Ueda, T., M’Saoubi, R., Mullany, B., Cooke, A.: On the measurement of temperature in material removal processes. CIRP Ann-Manuf. Techn. 56, 581–604 (2007)

4. Narayanan, V., Krishnamurthy, K., Hwang, J., Chandrasekar, S., Farris, T.N., Madhavan, V.: Measurement of the temperature field at the tool-chip interface in machining. In: Proceedings of NSF workshop on research needs in thermal aspects of material removal processes (2003)

5. Hwang, J., Kompella, S., Chandrasekar, S., Farris, T.: Measurement of temperature field in surface grinding using infra-red (IR) imaging system. J. Tribol. 125, 377–383 (2003)

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