Mechanical properties and thermal conductivity of lightweight and high-strength carbon-graphite thermal insulation materials

Author:

He Junchao,Wu HaihuaORCID,Zhong Lei,Zhong Qiang,Yang Qiang,Ye Xicong,Liu Zhi,Kang Yi

Abstract

AbstractThermal insulation composites are widely used in civil and military applications; however, it is difficult to achieve the synergy of multiple technical objectives such as lightweight, thermal insulation, high pressure resistance and high-temperature resistance by adopting traditional preparation techniques. In this study, a novel carbon-graphite thermal insulation material was rapidly prepared by exploiting the micro-thermal press additive manufacturing forming technology, and these multiple objectives were simultaneously achieved by introducing a large number of closed pores. It was found that the percentage of closed pores in the carbon-graphite insulation was increased by increasing the forming density or the amount of thermosetting phenolic resin added, but the thermal conductivity increased in parallel with the compressive strength, while the addition of pre-covered expandable graphite was able to achieve the synergy of high compressive strength and low thermal conductivity. When the content of thermosetting phenolic resin was 25 wt%, forming density was 1.2 g·cm−3, and expandable graphite was clad twice, the prepared carbon-graphite insulation exhibited a closed porosity/porosity ratio, compressive strength, and thermal conductivity of 48.92%, 16.432 MPa, and 0.743 W·m −1 K−1, which has the advantages of lightweight, high compressive strength, heat insulation and high-temperature resistance and has good prospects for industrial applications.

Funder

Innovative Research Group Project of the National Natural Science Foundation of China

the State Key Laboratory of Material Forming and Mould Technology, Huazhong University of Science and Technology Open Project Research Fund

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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