Growth mechanism of one dimensional tin nanostructures by electrodeposition
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s10853-015-9323-3.pdf
Reference44 articles.
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3. Nikolić ND, Popov KI, Pavlović LJ, Pavlović MG (2006) Morphologies of copper deposits obtained by the electrodeposition at high overpotentials. Surf Coat Technol 201(3–4):560–566. doi: 10.1016/j.surfcoat.2005.12.004
4. Djenizian T, Hanzu I, Eyraud M, Santinacci L (2008) Electrochemical fabrication of tin nanowires: a short review. C R Chim 11(9):995–1003. doi: 10.1016/j.crci.2008.05.003
5. Ye W, Yan J, Ye Q, Zhou F (2010) Template-free and direct electrochemical deposition of hierarchical dendritic gold microstructures: growth and their multiple applications. J Phys Chem C 114(37):15617–15624. doi: 10.1021/jp105929b
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