Rapid and effective method of laser metallization of dielectric materials using deep eutectic solvents with copper acetate-Reference-Cited by-同舟云学术

Rapid and effective method of laser metallization of dielectric materials using deep eutectic solvents with copper acetate

Published:2023-05-30 Issue:22 Volume:58 Page:9322-9336
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Khairullina Evgeniia,Shishov Andrey,Gordeychuk Dmitry,Logunov Lev,Levshakova Aleksandra,Sosnovsky Vladimir B.,Koroleva Aleksandra,Mikhailovsky Vladimir,Gurevich Evgeny L.,Chernyshov Ivan,Panov Maxim S.,Tumkin Ilya^ORCID

Funder

Russian Science Foundation

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://link.springer.com/content/pdf/10.1007/s10853-023-08573-6.pdf

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3. Bai S et al (2017) Laser-assisted reduction of highly conductive circuits based on copper nitrate for flexible printed sensors. Nano-Micro Lett 9:4. https://doi.org/10.1007/s40820-017-0139-3

4. Binh Nam V, Thi Giang T, Lee D (2021) Laser digital patterning of finely-structured flexible copper electrodes using copper oxide nanoparticle ink produced by a scalable synthesis method. Appl Surf Sci. https://doi.org/10.1016/j.apsusc.2021.151179

5. Ratautas K, Andrulevičius M, Jagminienė A, Stankevičienė I, Norkus E, Račiukaitis G (2019) Laser-assisted selective copper deposition on commercial PA6 by catalytic electroless plating—process and activation mechanism. Appl Surf Sci 470:405–410. https://doi.org/10.1016/j.apsusc.2018.11.091

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