Author:
Li Chang,Xu Yi-Tao,Zhao Bo,Jiang Li,Chen Shi-Guo,Xu Jian-Bin,Fu Xian-Zhu,Sun Rong,Wong Ching-Ping
Funder
National Natural Science Foundation of China
Guangdong and Shenzhen Innovative Research Team Program
Cooperation project of Chinese Academy of Sciences and Hubei Province, Shenzhen Electronic Packaging Materials Engineering Laboratory
Shenzhen High Density Electronic Packaging and Device Assembly Key Laboratory
Shenzhen Electronic Packaging Materials Engineering Laboratory
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Cited by
73 articles.
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