Author:
Plevachuk Yu.,Hoyer W.,Kaban I.,Köhler M.,Novakovic R.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference24 articles.
1. Gayle F, Becka G, Badgett J, Whitten G, Pan T, Grusd A, Bauer B, Lathrop R, Slattery J, Anderson I, Foley J, Gickler A, Napp D, Mather J, Olson C (2001) JOM 53(6):17
2. Lee HT, Chen MH, Jao HM, Hsu CJ (2004) J Electron Mater 33:1048
3. Chen S, Chen P, Wang C (2006) J Electron Mater 35:1982
4. Gasior W, Moser Z, Pstrus J (2003) J Phase Equilib 24(6):504
5. Lee BJ, Lee HM (1997) In: Mahidhara RK et al (eds) Design and reliability of solder and solder interconnections. TMS, Warrendale, PA, p 129
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