Vanillin-based degradable thermosets with superior dielectric properties via regulation of imine cross-linked structure
Author:
Funder
the Project funded by China Postdoctoral Science Foundation
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10853-023-09303-8.pdf
Reference44 articles.
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2. Evans AM, Giri A, Sangwan VK et al (2021) Thermally conductive ultra-low-k dielectric layers based on two-dimensional covalent organic frameworks. Nat Mater 20:1142. https://doi.org/10.1038/s41563-021-00934-3
3. Tao K, Qin F, Li Y et al (2022) Fabrication, mechanical and electrical properties of polyimide films cured at low-temperature assisted by microwave radiation. High Perform Polym 34:998. https://doi.org/10.1177/09540083221100366
4. Li Y, Sun G, Zhou Y, Liu G, Wang J, Han S (2022) Progress in low dielectric polyimide film—a review. Prog Org Coat 172:107103. https://doi.org/10.1016/j.porgcoat.2022.107103
5. Zhou W, Cao G, Yuan M et al (2023) Core–shell engineering of conductive fillers toward enhanced dielectric properties: a universal polarization mechanism in polymer conductor composites. Adv Mater 35:2207829. https://doi.org/10.1002/adma.202207829
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