Microstructure effects in braze joints formed between Ag/W electrical contacts and Sn-coated Cu using Cu–Ag–P filler metal-Reference-Cited by-同舟云学术

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Microstructure effects in braze joints formed between Ag/W electrical contacts and Sn-coated Cu using Cu–Ag–P filler metal

Published:2014-09-16 Issue:1 Volume:50 Page:324-333
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Yu H.,Sun Y.,Alpay S. P.,Aindow M.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s10853-014-8591-7.pdf

Reference17 articles.

1. Schwartz MM (2003) Brazing, 2nd edn. ASM International, Metals Park

2. Jacobson DM, Humpston G (2005) Principles of brazing. ASM International, Metals Park

3. Dawson RJC (1973) Fusion welding and brazing of copper and copper alloys. Wiley, New York

4. Davis JR (2001) Brazing, soldering and adhesive bonding. In: Davis JR (ed) Copper and copper alloys. ASM International, Metals Park, pp 303–318

5. Okamoto H (2000) Phase diagrams for binary alloys, Desk Handbook. ASM International, Metals Park

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5. Design of higher temperature copper brazing filler metals with reduced brittle phase content;Materials Today Communications;2023-06

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