Impression creep of monolithic and composite lead free solders-Reference-Cited by-同舟云学术

Impression creep of monolithic and composite lead free solders

Published:2007-04-26 Issue:17 Volume:42 Page:7592-7600
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Muthur Srinath Purushotham K.,Aswath Pranesh B.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s10853-006-1326-7.pdf

Reference28 articles.

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3. Frear DR (1991) Solder mechanics: a state of the art assessment. TMS, Warrendale, PA, p 191

4. Darveaux R, Murty KL, Turlik I (1992) J Miner Met Mater Soc 44:36

5. Murty KL, Turlik I (1992) In: Chen WT, Abe H (eds) Proceedings of the joint ASME/JSME advances in electronic packaging, vol EEP-1. ASME, New York, p 309

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